CERAMIC COATINGS AND STONEWARE - 1)TROUBLESHOOTING COMMON PROBLEMS OF THIS KIND OF SUBSTRATES AND BASE PREPARATION CYCLES FOR RESIN INSTALLATION

1.1. Cracks

In general, cracks must be permanently eliminated "sewing" the screed under the tile by making a double cut with a diamond disc (cutting depth of approx. 2025 mm x 10 mm width with a length varying from 15 to 20 cm depending on the size of the areas to be sewn). For sewing, the most suitable product is either PLAST EPO or, alternatively, NORPHEN FONDO SL thickened with silica for grouting a 6 ± 8 mm piece of iron rod.

 

1.2. Restoring thicknesses

The need for restoring levels to adjust the bottom according to the flatness of different kind of coatings and therefore characterized by different thicknesses is relatively common.

The most effective method is to apply GROVE MASSETTO with its primer GROVE PRIMER following the instructions given on the Technical Data Sheet.

Depending on the thickness,1 - 3 days interval time must be respected before proceeding with the laying of the resin.

 

1.3. Residual Moisture

For the installation of "normal" resins the maximum residual moisture percentage calculated on the underlaying screed in the corners of the rooms where there is more moisture accumulation shall be 3% measured according to the calcium carbide.

 

1.3.1. When humidity is between 3% and 6%

  • diamond grind the tiled surface so as to remove the glossy surface;
  • apply SOLID;
  • then proceed with the cycle previously scheduled for dry surfaces.

 

1.3.2. When humidity is more than 6%

  • diamond grind the tiled surface so as to remove the glossy surface;
  • apply Q-PRIMER and Q-RASANTE.

 

1.4. Removing Tile Joints

One of the main problems to be solved to realize a resin coating on tiled floors with large joints is the elimination of the joints "weave" that reappears even after using either a cementitious self-leveling compound or a resin based self-leveling compound.

It should be borne in mind that the joints do not reappear immediately: an inexperienced applicator can be deceived by the temporary disappearance of the weave right after the installation of a resin coating is finished, but over time it will reappear.

 

How to permanently eliminate the weave

It should be taken into account that the weave can not be eliminated either by using resins or pure cementitious systems or loaded with a small amount of aggregate: the typical formulation that shall be used is a compound made up of at least 6 parts of aggregates and the remaining of binders. This type of mixes is neither very smooth nor very self-leveling, for this reason it gives rise to a surface that should be further skim coated after treatment: therefore, the two following types of highly proven procedures are recommended:

 

1.4.1. With self-leveling resin:

  • diamond grind the surface;
  • lay down a 160gr/m2 Fiberglass Mesh without overlaps and apply a coat of approx. 250 gr / m2 of NORPHEN FONDO SL with a roller, in order to make the mesh stick firmly;
  • allow time for the substrate to cure and then proceed with skim coating using 750 gr / sq.m of NORPHEN FONDO SL bulk charged with 30% quartz 0.1-0.3 and 50-70% quartz 0.3-0.9 applied with a 50 steel spatula and broadcast to excess with quartz 0.3-0.9 wet on wet.

 

 

The day after the excess quartz should be removed, the surface sanded down with a monobrush armed with either a 24 or 36 grit emery cloth and then the scheduled cycle must be applied.

 

1.4.2. With Self-Leveling Cementitious Systems:

  • diamond grind the surface;
  • apply either a coat of RICRETE 1C or NORPHEN RICRETE broadcast with quartz 0.7-1.2;
  • pour LEVEL FINO with a consumption of not less than 12 kg / sq m;
  • allow 7 days for the substrate to cure, then polish with a three heads polishing machine for marble until a perfectly flat surface is achieved.

 

 

 

 

Proceed with subsequent processing taking into account the fact that, after polishing, the surface changes into a high porosity substrate that requires both a first skim coat and broadcast to eliminate the pores that generate "blowholes" on a film of fluid resin.

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